Semiconductors Equipment
Model L — DPC Ceramic Metallization System
The Model L (L1000) is a three-chamber vertical in-line DPC (Direct Plated Copper) ceramic metallization coating system, purpose-built for high-end electronic device heat dissipation and high-density integration.
It precisely targets advanced fields such as semiconductors, power devices and optical communications, delivering a system-level solution for high-aspect-ratio through-hole metallization and high-quality thin-film deposition on DPC ceramic substrates.
Engineered for automotive LiDAR VCSEL packaging, AI computing server substrates and RF front-end modules, it enables high productivity at low cost.
Would you like to learn more? Then click on the system or have a look at the applications.
Model L
DPC Ceramic Metallization Coating
H2 High-Power Cathode
Precision Patterning Technology
Core Advantages
Ultra-fast Deposition
Break through capacity bottlenecks with extreme deposition efficiency.
HiPIMS-Level Ionization
HiPIMS-grade high ionization rate to strengthen film performance.
Low-Temperature Rapid Deposition
Low-temperature, high-speed deposition achieving zero surface defects.
Applications
Automotive LiDAR (VCSEL Packaging)
Smart Headlamps & High-Power LED
RF Front-End & Phased Array
1661 Xingping 2nd Road, Pinghu Industrial Park, Zhejiang Province, China 314200