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0.5-5μm flexible copper plating and other metal films, the optimal thickness for multiple applications. Suitable for: chip packaging, lithium batteries, photovoltaic, communications, etc.
Copper Composite Foil / Vacuum Plated Aluminum Foil / Vacuum Plated Copper Foil
Vacuum Deposition | One Step | Double Coating | 0.5 -2 micron
Limit the electromagnetic wave to a certain range, effectively suppress electromagnetic interference.
Vacuum Evaporation | Dielectric Constant: 2.8dk | Shielding: 82dB | 0.1-0.3 micron
PI Heating Film / PTC Heating Film / Heat Dissipation Film
Vacuum Deposition | Metal Oxides | Composite Copper | 0.5 -2 micron
The advantage of metallized film capacitors is the “self-healing” property. Naxau realizes one-step double-sided deposition of Cu on polyester film.
Vacuum Deposition | Type C1: 1μmCu+4.5μmPET+1μmCu, total thickness 6.5μm
The Model R650 can coat Cu film on both sides of PET/PP/PI substrates (without Cr primer) to form highly dense, strong adhesion metal composite foils, and is equipped with a high-precision winding system, a thermal management system, a tension control system, a strip guiding system, a plasma pre-treatment and an integrated anti-oxidation system, an on-line thickness control and a process control system to achieve a high-quality and high-efficiency coating. effect.
HVLP copper foil, will be the new hot spot in the field of high-speed and high-frequency electrical signals such as 5G.
Fast PVD Coating Technology
In 2023, Naxau officially launched JVAD high-power liquefied vacuum coating technology, which can realize rapid PVD coating of one micron a minute.JVAD technology, is expected to break the application and price boundaries of PVD, and extend the hard functional film to more applications. The rapid thickening of PVD coating has a price comparable to that of traditional electroplating, but with higher film hardness, bonding force, corrosion resistance, film thickness uniformity and many other advantages of PVD technology.
Currently, Naxau can provide JVD coating prototyping and customized JVD coating equipment and multi-chamber rapid production line, welcome to inquire!
High Frequency High Speed, Cell Phone EMI, FCCL
PET, PI film as a substrate to complete the flexible line manufacturing, instead of imported high-precision FCCL. advantages: ultra-thin (3-5um PI) copper foil, no Cr bottoming, improve the accuracy of etched lines.
Expandable direction: Optical AR winding coating, high melting point metal winding coating, solid state battery winding coating with pure Li electrode.。
Ultra-thin film copper plating products for COF applications
PVD Copper coating on Ultra Thin film
COF (Chip On Flex, or, Chip On Film), often referred to as crystal laminated film, is the integrated circuit (IC) fixed in the flexible circuit board on the grain soft film construction technology, the use of flexible additional circuit boards as a packaged chip carrier will be a combination of the chip and the flexible substrate circuits, or a single reference to the unencapsulated chip of the flexible additional circuit boards, including tape-and-reel package production (TAB substrate. The process is called TCP), flexible board connection chip assembly, flexible IC carrier board packaging.
Lithium-supplemented Coil Coating Equipments
Lithium-ion battery lithium replenishment technology is an important means to improve battery energy density. Naxau utilizes vacuum lithium plating film technology and roll-to-roll cycle operation to realize one-step lithium plating on copper foil. Ten years of safe operation records can ensure the stability and excellent cycle performance during the subsequent use of the battery.
Solid state batteryNegative electrode coated with lithium film.